Dear Intel® customers,

Starting the week of July 1st 2008, Intel will start shipping new boxed processor packaging that has been reduced in size by up to 40%. The new packaging material is primarily being done to eliminate over 700,000 lbs. of paper packaging materials and 100,000 lbs. of plastic packaging materials annually from the packaging waste stream. This packaging change will have the following implications to customers: 

• Starting the week of July 1st 2008, the reduced size retail boxed processors will be shipping simultaneously with retail boxed processors using current packaging (larger size). This will cover the mobile, desktop, and server product segments.
• By the end of 2008, Intel will have transitioned virtually all boxed processor packaging to the new reduced size and will discontinue use of the larger size packaging that is in use today.
• The only thing different between the two packages is the packaging material and the box look-and-feel. The processor, warranty manual content, thermal solution, and boxed product codes are the same.
• The Intel part number of the thermal solution did change as a result of the packaging conversion.
• The Land Grid Array (LGA) cover will be removed for the E7xxx series processors only.
• The new packaging will impact both the FPO labels and retail processor box look-and-feel.  

Boxed processor packaging changes:

• New boxed processor cartons will continue using the same outer material with an internal plastic shell
• Boxes intended for sale in China exclusively may utilize different artwork and use simplified Chinese text instead of English.
• The size of the box will be reduced up to 40% over the current packaging size, but the size reduction will vary based on the size of the enclosed thermal solution.

Warranty / installation booklet size changes:

• The warranty book included in the boxed processor will be slightly reduced in size and will utilize a saddle stitch binding technique.
• Warranty information and installation instructions remain unchanged. The E7xxx series booklet will reflect the LGA cover removal changes.

FPO label changes:

• FPO labels are undergoing a slight transformation. The size and shape is slightly changed and the processor product number is now more prominently displayed. A portion of the FPO label will fold over the corner of the boxed processor and act as an additional factory seal.
  
• Current FPO Label Size (image not to exact scale): 4.5" x 1.75"
  
  
  
  
• New FPO Label Size (image not to exact scale): 3.875" x 2.0"
  
  
  
• China Specific FPO label will be slightly larger at 5.0" x 2.0" 
   
• Distribution Label Layout remains unchanged
  
  

• Turn the box on its side with the FPO label up and the hologram on lower part of the box
• Break FPO label seal as shown below. (Note: this is a preproduction FPO label and does not contain the normal FPO label text)

• Open box sleeve and turn the box back to the front side as shown 
• Remove the thermal solution with the heatsink side facing up

• Remove the processor micro-clamshell (friction-fitted / no welds)

• Remove the thermal solution and processor from their respective clamshells

• Remove the Warranty / Installation manual. (Note: the processor shown is a preproduction engineering sample)

This applies to:

Intel® Core™2 Duo Desktop Processor Intel® Core™2 Duo Mobile Processor Intel® Core™2 Extreme Mobile Processor Intel® Core™2 Extreme Processor Intel® Core™2 Quad Processor Intel® Pentium® Processor for Desktop Intel® Pentium® Processor for Mobile Intel® Xeon® Processor Intel® Xeon® Processor 3000 Series Intel® Xeon® Processor 5000 Series Intel® Xeon® Processor 7000 Series